What's Current in
Engineering
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Photo Credit
Brian Long
Co-PI Andrew Jayich will use the new technology to create ion traps like the one shown here, in which colors indicate independent electrodes to control trapped ions.
Galan Moody leads successful effort to secure $1.3 million for advanced 3D printing
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Courtesy Image
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Photo Credit
Lilli McKinney
Misha Sra
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Photo Credit
Brian Long
A quantum magnetometer on a chip
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With this method, your empty detergent bottle can be turned into more detergent
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Courtesy image
In this image of the newly developed transmitter assembly, the small, brownish chip on the left is the electronic integrated circuit (EIC), and the larger, black-and-gold chip on the right is the photonic integrated circuit (PIC). The long structure on the left side of the PIC is the modulator, which converts the electrical signal into an optical one. Light gets coupled into and out of the chip through the fibers on the right side of the PIC. Everything is mounted on a printed circuit board (PCB), with gold wire bonds connecting the chips. Data flows from left to right, where the incoming electrical signal gets amplified by the EIC, converted to an optical signal by the PIC, and sent out via fiber to its destination.
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Photo Credit
Courtesy photo
An AI-generated image depicts engineers working on an AI-enabled robot.
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Oil and gas extraction infrastructure in the Permian Basin