Engineering

In this image of the newly developed transmitter assembly, the small, brownish chip on the left is the electronic integrated circuit (EIC), and the larger, black-and-gold chip on the right is the photonic integrated circuit (PIC). The long structure on the left side of the PIC is the modulator, which converts the electrical signal into an optical one. Light gets coupled into and out of the chip through the fibers on the right side of the PIC. Everything is mounted on a printed circuit board (PCB), with gold wire bonds connecting the chips. Data flows from left to right, where the incoming electrical signal gets amplified by the EIC, converted to an optical signal by the PIC, and sent out via fiber to its destination.

An AI-generated image depicts engineers working on an AI-enabled robot.

Oil and gas extraction infrastructure in the Permian Basin

Leeta's Kira Wyckhoff (left), and Linus Kautzsch (right), with materials professor Ram Seshadri (center)

Capstone project client Steve Ferreira (center) with (from right): Professor Tyler Susko and team members James Freda, Carlos Rivera, Janna Crocker, Joseph Byun and Cannon Crow.

From l to r: Ambuj Singh, Christopher Kruegel, João Hespanha, Giovanni Vigna

Professor Umesh Mishra